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SCRIBING
WORKSTATIONS were developed
specifically for the difficult job
of processing ceramics, with the
first ceramic scribing system introduced
to industry in the late 1960s. Since
then, PRIMA divisions have supplied
hundreds of systems to service the
microelectronic industry. As the
ceramic industry has matured and
been driven by new technologies,
so too have the ceramic processing
systems offered by PRIMA.
Our current line of ceramic processing
systems for scribing, cutting and
drilling, now utilizes the latest
in compact, sealed CO2
laser technology, user-friendly
PC controls, closed loop ball screw
or linear motor tables, and auto-vision
for accurate alignment. We offer
standard, turnkey systems optimized
to provide reliable production processing
of both fired and unfired ceramics.
Five key benefits:
| Ø |
Totally
turnkey production machine |
| Ø |
Process
fired & unfired ceramic
- cut and scribe with one machine |
| Ø |
Laser
chosen to optimize ceramic scribing
and cutting |
| Ø |
Linear
tables provide higher speed,
higher reliability |
| Ø |
PC-based
user-friendly System 94 controller |
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Model 150S
is equipped with a 150-watt sealed CO2 laser
source and single beam delivery and head. The 12" x
12" motion table is standard. Model 150S can achieve
scribing speeds of up to 10" per second.
Model 250D is equipped with
a 250-watt sealed CO2 laser source and dual
beam delivery. This machine doubles the production speed
of a single head by processing two substrates simultaneously.
The system can be utilized with two 125-watt beams or
a single 250-watt beam and can achieve scribing speeds
of up to 10" per second in dual beam configuration. |
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Model 500Q
is equipped with a four-beam output configuration, with
125 watt CO2 power for each beam, for customers
requiring high throughput ceramic processing. The 500Q
features a 500-watt sealed CO2 laser source
and a standard table size of 18" x 18" with either ball
screw or linear motor tables. The Model 500Q can achieve
scribing speeds of up to 10" per second, processing
up to four parts simultaneously.
All above models are supplied with automatic cover gas
control, closed loop cooling system, air filter dryer
system, and either ball screw or linear motor tables.
Optional features include manual TV aligning or auto-vision
that adjusts the software program to the reference alignment
targets, programmable Z-axis, boring head, and an auxiliary
rotary table. |
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| SCRIBING
WORKSTATIONS - CONFIGURATION GUIDE |
| LASER SOURCE |
150 Watt
CO2 |
250 Watt
CO2 |
500 Watt
CO2 |
| Number of Beams |
1 |
2/1 |
4 |
| Watts per Beam |
150 |
125/250 |
125 |
| TABLE SIZE |
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| 12" x 12" |
Standard |
Standard |
NA |
| 18" x 18" |
Option |
Option |
Standard |
| 24" x 30" |
Option |
Option |
Option |
| TABLE DRIVES |
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| Ball screw |
Customer Selection |
Customer Selection |
Customer Selection |
| Linear motor |
Customer Selection |
Customer Selection
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Customer Selection
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| Closed-loop cooling & air filter dryer |
Standard |
Standard |
Standard |
| Auto cover gas control |
Standard |
Standard |
Standard |
| VISION |
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| Manual TV |
Option |
Option |
Option |
| Auto-vision |
Option |
Option |
Option |
| Programmable Z-axis |
Option |
Option |
N/A |
| Boring Head |
Option |
Option |
Option |
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| LASER
SPECIFICATIONS |
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150 Watt CO2 |
250 Watt CO2 |
500 Watt CO2 |
| Power rated1 |
150 watts2 |
250 watts1 |
500 watts2 |
| Peak effective power |
150-450 watts |
200-750 watts |
250-1500 watts |
| Pulse energy range |
10-350 mJ |
10-500 mJ |
25-1000 mJ |
| Pulse rise and fall time |
<50 µsec |
<60 µsec |
<90 µsec |
| Beam divergence (full angle) |
2.3 ± 0.3 mrad |
2.1 ± 0.3 mrad |
1.4 ± 0.3 mrad |
| Emission wavelength |
10.4-10.8 µm or 9.4 µm |
10.4-10.8 µm or 9.4 µm |
10.4-10.8 µm or 9.4 µm |
1 Guaranteed at 600 µs
pulse width at 60% duty cycle
2 Guaranteed at 500 µs pulse width at 50% duty
cycle |
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